UltraPrep IV
Description
Products
Home > Products > RKD DECAP
RKD DECAP
Model 2500
・Fast, easy set up - Including video alignment.
・Four point die alignment is available to eliminate rotational errors.
・Simple operator interface with full process programmability.
・System automation of thinning and polishing processes.
・Programmable depth accurate to +/- 1 micron.
・Removable sample holders – allows removal without re-mounting or aligning.
・Contour tool path for grinding, lapping and polishing.
・No leveling required during mounting or on the machine.
・Little final thickness variation (less than +/- 0.005 mm) on thinned die.
・Near zero down force during die thinning.
・Manual input of measured sample thickness for precise thickness control.
・Easy removal of heat spreaders, encapsulant, and die attach pads.
・Available and inexpensive tooling.
・Small footprint – takes little bench space.
・Four point die alignment is available to eliminate rotational errors.
・Simple operator interface with full process programmability.
・System automation of thinning and polishing processes.
・Programmable depth accurate to +/- 1 micron.
・Removable sample holders – allows removal without re-mounting or aligning.
・Contour tool path for grinding, lapping and polishing.
・No leveling required during mounting or on the machine.
・Little final thickness variation (less than +/- 0.005 mm) on thinned die.
・Near zero down force during die thinning.
・Manual input of measured sample thickness for precise thickness control.
・Easy removal of heat spreaders, encapsulant, and die attach pads.
・Available and inexpensive tooling.
・Small footprint – takes little bench space.
