Plasma

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Plasma decap of a PEMS device in pure O2 or Ar-O2 will remove epoxy and result in exposure of the die without damaging interior package metals such as Au, Ag, Cu or III-IV materials such as GaAs, InP, etc.

Plasma decap with CF4-O2 is faster than with pure O2 but will damage the die as soon as exposed.

Pure O2 decap will retain device functionality.