Laser
- The entire process is 100% controllable by the operator, allowing one to determine the precise depth, location, and geometry of the ablation area through our User Interface.
- Real time color vision system provides a continuous control of the ablation process.
- Two fully CNC controlled axes and two 10Mp independent high resolution Ethernet cameras ensure the precise positioning.
- Integrated red laser pointer for comfortable adjustment and positioning of the work piece.
- No destruction of wires during opening.
- Laser class one safety cabinet, no additional cost for laser protection.
- Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as remove resin and plastics, expose wire bonds.
